Design of Printed Circuit Boards and Printed Board Assembly
2 Oct 2026 - 27 Nov 2026
The pandemic has shown the importance of electronics and chips, and the need for technical skilled people in this domain. In this course, instructors from KU Leuven and multiple leading companies in electronic design, introduce you to printed board assembly covering the build-up and manufacturing of a PCB, the design of a PCB with Signal and Power integrity in mind and discuss how EMC and EMI is handled at PCB level. The course offers theoretical sessions as well as several hands-on trainings.
Practical information:
2 Oct 2026 - 27 Nov 2026
40 hours
Department of Electrical Engineering (ESAT), Kasteelpark Arenberg 10, 3001 Heverlee
English
Target audience: This course is open for a rather broad technical audience.
Want to register?
- Prerequisites: Participants must have a Bachelor or a Master in a technical field, or equivalent through professional work experience.
- Price: Professionals: € 3600 - PhD students, Postdocs and young graduates: € 900 - regular Bachelor and Master students: € 360
Knowledge on following topics will be necessary:
- electronic systems,
- current, voltage, inductors, capacitors, switches, resistors, transistors,
- basics of electronic circuits and networks.
Georganiseerd door:
Upon completion of this course, the student...
- has insight in Printed Circuit Board (PCB) and Printed Board Assembly (PBA) technology, their capabilities, limitations, and cost drivers;
- can design a PCB with Design-for-Manufacturing (DfM), Design-for-Assembly (DfA) and Design-for-Reliability (DfR) in mind;
- has insight in PCB and PBA failure mechanisms, their stressors and failure mitigation;
- can asses the reliability and quality of a PCB and PBA;
- has insight in the effects of Electromagnetic Compatibility (EMC) and Electrostatic Discharge (ESD) for a PBA;
- can identify EMC risks in a PCB design review;
- can apply specific PCB design techniques for EMC/ESD like:
- input/output filtering
- component placement and selection
- loop area minimization
- ground management
- can identify Signal Integrity (SI) and Power Integrity (PI) problems in a pcb design and adapt the design accordingly;
- understands and can apply the techniques of impedance matching, length matching and decoupling strategies;
- has some rules of thumb at his disposal for SI/PI design;
- can use the necessary tools to measure and document possible Signal integrity problems.
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